215760-2008

Molex
538-215760-2008
215760-2008

Mfr.:

Description:
Headers & Wire Housings Micro-Fit+ RA Header 8 Circuits Black

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 1.533

Stock:
1.533 Can Dispatch Immediately
Quantities greater than 1533 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
2,12 € 2,12 €
1,74 € 43,50 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
Headers
PCB Receptacle
8 Position
3 mm (0.118 in)
1 Row
PCB Mount
Solder Pin
Right Angle
Gold
215760
Micro-Fit+
Wire-to-Board, Power
- 40 C
+ 105 C
Tray
Brand: Molex
Contact Material: Copper Alloy
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 13 A
Flammability Rating: UL 94 V-0
Housing Colour: Black
Housing Gender: Receptacle
Housing Material: Liquid Crystal Polymer (LCP)
Insulation Resistance: 1 GOhms
Product Type: Headers & Wire Housings
Factory Pack Quantity: 91
Subcategory: Headers & Wire Housings
Voltage Rating: 600 VAC/600 VDC
Part # Aliases: 2157602008 02157602008
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Micro-Fit+ Connectors

Molex Micro-Fit+ Connectors offer superior design options for flexibility and efficient assembly. The connectors offer a high current rating of up to 13.5A with a 3mm pitch and use the same amount of space that smaller connectors occupy. Features include a smaller PCB footprint, a reduced mating force of 40%, and an enhanced TPA design that provides stability and security for the terminals inside the receptacle. Molex Micro-Fit+ applications include consumer, telecommunication/networking, medical, sustainable energy, and automotive.