208381-0303

Molex
538-208381-0303
208381-0303

Mfr.:

Description:
Headers & Wire Housings Pico-Clasp1.0 SRVTETP .76GLHNat 3Ckt

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 8800   Multiples: 8800
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
1,26 € 11.088,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
208381
Pico-Clasp
Brand: Molex
Product Type: Headers & Wire Housings
Factory Pack Quantity: 8800
Subcategory: Headers & Wire Housings
Part # Aliases: 2083810303 02083810303
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Attributes selected: 0

Compliance Codes
USHTS:
8536694040
Origin Classifications
Country of Origin:
Japan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Pico-Clasp™ Wire-to-Board Connectors

Molex Pico-Clasp™ Wire-to-Board Connectors are the smallest pitch (1.00mm) wire-to-board connectors with positive lock. Pico-Clasp 1.00mm pitch connectors come in single-row and dual-row configurations. The series offers friction and positive locks for various application needs. Pico-Clasp is designed for various connections in flat panel displays (FPD). This Molex connector system is also ideal for use in notebook PCs and other compact devices.

Signal Wire-to-Wire/Wire-to-Board Connectors

Molex Signal Wire-to-Wire/Wire-to-Board Connectors and Connector Systems feature a variety of wire-to-board signal connectors that offer design flexibility. Molex Signal WTW/WTB connectors and systems are ideal for personal computers and lighting, as well as automotive and industrial applications, depending on the model.

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.