173359-0002

Molex
538-173359-0002
173359-0002

Mfr.:

Description:
I/O Connectors zCD SB Style 1 .75mm W/O GSKT & EMIFGRS

ECAD Model:
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In Stock: 72

Stock:
72 Can Dispatch Immediately
Factory Lead Time:
51 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 72 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
53,22 € 53,22 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: I/O Connectors
RoHS:  
I/O Connectors
Female
120 Position
0.75 mm
30 V
Gold
PCB Mount
Through Hole
Right Angle
173359
- 40 C
+ 85 C
Brand: Molex
Color: Black
Current Rating: 1 A
Flammability Rating: UL 94 V-0
Housing Material: Thermoplastic (TP)
Number of Ports: 1 Port
Product Type: I/O Connectors
Factory Pack Quantity: 675
Subcategory: I/O Connectors
Part # Aliases: 01733590002
Products found:
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Attributes selected: 0

Compliance Codes
TARIC:
8536693000
CNHTS:
8536690000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

zCD Interconnect System Connector

Molex zCD Interconnect System Connector supports 400Gbps Ethernet applications and transmits 400GBps data rates (25GBps per serial lane) with excellent signal integrity (SI), Electro-Magnetic Interference (EMI) protection, and thermal cooling. The zCD connector is a press-fit connector the ensures a robust and simple board termination. The Molex zCD connector is designed to accept a broad range of customer-specified thermal modules and heat sinks and provides excellent thermal management.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.