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173210-1126

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See Product Specifications

Mouser No:

538-173210-1126

Mfr. No:

173210-1126

Mfr.:

Molex

Description:

High Speed/Modular Connectors Impel PLUS 6Px16C Ungd Assy

Lifecycle:

Factory Special Order:

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Datasheet:

173210-1126 Datasheet

ECAD Model:

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Availability

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
Product:	Receptacles
Number of Positions:	192 Position
Number of Rows:	12 Row
Pitch:	1.9 mm
Termination Style:	Through Hole
Contact Plating:	Tin
Series:	173210
Brand:	Molex
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	SG
Current Rating:	750 mA
Housing Colour:	Black
Housing Material:	Thermoplastic
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Right Angle
Orientation:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	32
Subcategory:	Backplane Connectors
Tradename:	Impel
Voltage Rating:	29.9 VAC/DC
Part # Aliases:	1732101126 01732101126

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Attributes selected: 0

Filter Document:

TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
BRHTS:: 85366990
ECCN:: EAR99

Impel Backplane Interconnect System

Molex Impel Backplane Connector System achieves signal integrity, density, and data rates up to 40Gbps while enabling backward and forward compatibility. A compact, compliant-pin backplane connector enables backward and forward compatibility with various high-end architectures. 92Ω nominal impendence minimizes impedance discontinuities and multiple pitch options are available for design flexibility. The connectors deliver superior density and electrical performance, low crosstalk, low insertion loss, and minimal performance variations across all channels and frequencies to 20GHz. Molex Impel applications include telecommunications, data networking, industrial, and military/aerospace.

Impel & Impel Plus Backplane Interconnect System

Molex Impel Backplane Interconnect System delivers industry-leading signal integrity and density while providing a scalable price and performance path for future data-rate enhancements.