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172501-4002

Mouser No:

538-172501-4002

Mfr. No:

172501-4002

Mfr.:

Molex

Description:

I/O Connectors zSFP+ Stkd 2x4 Assy w/Improved Airflow

Lifecycle:

Factory Special Order:

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Datasheet:

172501-4002 Datasheet (PDF)

ECAD Model:

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Availability

Stock:: Non-Stocked, Call To Request a Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	I/O Connectors
RoHS:
Product:	Accessories
Contact Plating:	Gold
Mounting Style:	Through Hole
Termination Style:	Press Fit
Mounting Angle:	Right Angle
Series:	172501
Brand:	Molex
Color:	Black
Contact Material:	Copper Alloy
Flammability Rating:	UL 94 V-0
Housing Material:	Thermoplastic
Number of Ports:	8 Port
Product Type:	I/O Connectors
Factory Pack Quantity:	40
Subcategory:	I/O Connectors
Tradename:	zSFP+
Type:	zSFP+
Part # Aliases:	1725014002 01725014002
Unit Weight:	79,363 g

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Filter Document:

Datasheet

172501-4002 Datasheet (PDF)

PCN

Product Change Notification (PDF)

RoHS Certificate (PDF)

Compliance Codes

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: Indonesia
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).