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172140-1808

Name: Molex 172140-1808
Brand: Molex
SKU: 538-172140-1808
Price: 29.95 EUR
Availability: OutOfStock

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Mouser No:

538-172140-1808

Mfr. No:

172140-1808

Mfr.:

Molex

Description:

High Speed/Modular Connectors Impel 4x8 Unguided RAM Assy Long

Datasheet:

172140-1808 Datasheet

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	29,95 €	2.875,20 €
	28,69 €	8.262,72 €
576	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Number of Positions:	64 Position
Number of Rows:	8 Row
Pitch:	1.9 mm
Contact Plating:	Gold
Series:	172140
Brand:	Molex
Contact Material:	Tin
Current Rating:	750 mA
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	32
Subcategory:	Backplane Connectors
Tradename:	Impel
Voltage Rating:	150 VAC/DC
Part # Aliases:	1721401808 01721401808
Unit Weight:	20,203 g

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Datasheet

172140-1808 Datasheet

Images

TARIC:: 8536693000
CNHTS:: 8536690000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

Impel Backplane Interconnect System

Molex Impel Backplane Connector System achieves signal integrity, density, and data rates up to 40Gbps while enabling backward and forward compatibility. A compact, compliant-pin backplane connector enables backward and forward compatibility with various high-end architectures. 92Ω nominal impendence minimizes impedance discontinuities and multiple pitch options are available for design flexibility. The connectors deliver superior density and electrical performance, low crosstalk, low insertion loss, and minimal performance variations across all channels and frequencies to 20GHz. Molex Impel applications include telecommunications, data networking, industrial, and military/aerospace.

Impel & Impel Plus Backplane Interconnect System

Molex Impel Backplane Interconnect System delivers industry-leading signal integrity and density while providing a scalable price and performance path for future data-rate enhancements.