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171395-1208

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Mouser No:

538-171395-1208

Mfr. No:

171395-1208

Mfr.:

Molex

Description:

High Speed/Modular Connectors Impel 90 Ohm 6 Pair Vertical Backplane Header 1.90mm Pitch Unguided Open Endwalls 12 Columns 144 Circuits Pin Length 5.50mm Plated Through Hole Dimension 0.36mm

Lifecycle:

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Datasheet:

171395-1208 Datasheet

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	144 Position
Number of Rows:	12 Row
Pitch:	1.9 mm
Termination Style:	Through Hole
Contact Plating:	Gold
Series:	171395
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	SG
Current Rating:	750 mA
Housing Colour:	Black
Insulation Resistance:	90 Ohms
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Vertical
Orientation:	Straight
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	156
Subcategory:	Backplane Connectors
Tradename:	Impel
Part # Aliases:	1713951208 01713951208

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Datasheet

171395-1208 Datasheet

Models

STP File (Zip)

Specification Sheets

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TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
BRHTS:: 85366990
ECCN:: EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

Impel Backplane Interconnect System

Molex Impel Backplane Connector System achieves signal integrity, density, and data rates up to 40Gbps while enabling backward and forward compatibility. A compact, compliant-pin backplane connector enables backward and forward compatibility with various high-end architectures. 92Ω nominal impendence minimizes impedance discontinuities and multiple pitch options are available for design flexibility. The connectors deliver superior density and electrical performance, low crosstalk, low insertion loss, and minimal performance variations across all channels and frequencies to 20GHz. Molex Impel applications include telecommunications, data networking, industrial, and military/aerospace.

Impel & Impel Plus Backplane Interconnect System

Molex Impel Backplane Interconnect System delivers industry-leading signal integrity and density while providing a scalable price and performance path for future data-rate enhancements.