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171395-1105

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Mouser No:

538-171395-1105

Mfr. No:

171395-1105

Mfr.:

Molex

Description:

High Speed/Modular Connectors Impel 92 Ohm, 6 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided, Open Endwalls, 10 Columns, 120 Circuits, Pin Length 5.50mm, Plated Through Hole Dimension 0.46mm

Lifecycle:

Factory Special Order:

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Datasheet:

171395-1105 Datasheet

ECAD Model:

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Availability

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Pricing (EUR)

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	120 Position
Number of Rows:	12 Row
Pitch:	1.9 mm
Termination Style:	Through Hole
Contact Plating:	Gold
Series:	171395
Brand:	Molex
Contact Material:	Tin
Current Rating:	750 mA
Housing Colour:	Black
Insulation Resistance:	92 Ohms
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Vertical
Orientation:	Straight
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	156
Subcategory:	Backplane Connectors
Tradename:	Impel
Voltage Rating:	150 VAC/DC
Unit Weight:	8,100 g

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Datasheet

171395-1105 Datasheet

Models

RoHS Certificate (PDF)

Compliance Codes

TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: Not available
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

Impel Backplane Interconnect System

Molex Impel Backplane Connector System achieves signal integrity, density, and data rates up to 40Gbps while enabling backward and forward compatibility. A compact, compliant-pin backplane connector enables backward and forward compatibility with various high-end architectures. 92Ω nominal impendence minimizes impedance discontinuities and multiple pitch options are available for design flexibility. The connectors deliver superior density and electrical performance, low crosstalk, low insertion loss, and minimal performance variations across all channels and frequencies to 20GHz. Molex Impel applications include telecommunications, data networking, industrial, and military/aerospace.

Impel & Impel Plus Backplane Interconnect System

Molex Impel Backplane Interconnect System delivers industry-leading signal integrity and density while providing a scalable price and performance path for future data-rate enhancements.