171335-1808

Molex
538-171335-1808
171335-1808

Mfr.:

Description:
High Speed/Modular Connectors IMPEL 3PX8C BP ASSY UNGD OPEN 5.

Datasheet:
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 512   Multiples: 512
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
13,92 € 7.127,04 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: High Speed/Modular Connectors
RoHS:  
48 Position
6 Row
1.9 mm
Gold
171335
Brand: Molex
Contact Material: Tin
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: SG
Current Rating: 750 mA
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Mounting Angle: Vertical
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 512
Subcategory: Backplane Connectors
Tradename: Impel
Voltage Rating: 150 VAC/DC
Unit Weight: 3,560 g
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Attributes selected: 0

Datasheet

Models

TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

Impel Backplane Interconnect System

Molex Impel Backplane Connector System achieves signal integrity, density, and data rates up to 40Gbps while enabling backward and forward compatibility. A compact, compliant-pin backplane connector enables backward and forward compatibility with various high-end architectures. 92Ω nominal impendence minimizes impedance discontinuities and multiple pitch options are available for design flexibility. The connectors deliver superior density and electrical performance, low crosstalk, low insertion loss, and minimal performance variations across all channels and frequencies to 20GHz. Molex Impel applications include telecommunications, data networking, industrial, and military/aerospace.

Impel & Impel Plus Backplane Interconnect System

Molex Impel Backplane Interconnect System delivers industry-leading signal integrity and density while providing a scalable price and performance path for future data-rate enhancements.

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