171320-1038

Molex
538-171320-1038
171320-1038

Mfr.:

Description:
High Speed/Modular Connectors Impel 4Px8C 1.9mm DC Unguided

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 100

Stock:
100 Can Dispatch Immediately
Factory Lead Time:
4 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
18,45 € 18,45 €
16,92 € 169,20 €
16,28 € 407,00 €
15,77 € 756,96 €
15,65 € 1.502,40 €
15,26 € 4.394,88 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: High Speed/Modular Connectors
RoHS:  
Receptacles
64 Position
8 Row
1.9 mm
Press Fit
Gold
171320
Brand: Molex
Contact Material: Tin
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: SG
Current Rating: 750 mA
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Mounting Angle: Right Angle
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 48
Subcategory: Backplane Connectors
Tradename: Impel
Voltage Rating: 150 VAC/DC
Part # Aliases: 1713201038 01713201038
Unit Weight: 238,140 g
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

TARIC:
8536693000
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Impel Backplane Interconnect System

Molex Impel Backplane Connector System achieves signal integrity, density, and data rates up to 40Gbps while enabling backward and forward compatibility. A compact, compliant-pin backplane connector enables backward and forward compatibility with various high-end architectures. 92Ω nominal impendence minimizes impedance discontinuities and multiple pitch options are available for design flexibility. The connectors deliver superior density and electrical performance, low crosstalk, low insertion loss, and minimal performance variations across all channels and frequencies to 20GHz. Molex Impel applications include telecommunications, data networking, industrial, and military/aerospace.

Impel & Impel Plus Backplane Interconnect System

Molex Impel Backplane Interconnect System delivers industry-leading signal integrity and density while providing a scalable price and performance path for future data-rate enhancements.