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171224-1001

Name: Molex 171224-1001
Brand: Molex
SKU: 538-171224-1001
Price: 26.68 EUR
Availability: OutOfStock

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Mouser No:

538-171224-1001

Mfr. No:

171224-1001

Mfr.:

Molex

Description:

I/O Connectors zSFP+ Stacked, 2X1 w/Metal No LP

Datasheet:

171224-1001 Datasheet

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More Information

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Availability

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Minimum: 90 Multiples: 90

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	26,68 €	2.401,20 €
	26,01 €	7.022,70 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	I/O Connectors
RoHS:
Product:	Receptacles
Gender:	Jack (Female)
Number of Positions:	40 Position
Pitch:	0.8 mm
Voltage Rating:	30 VAC
Contact Plating:	Gold
Mounting Style:	Panel Mount
Termination Style:	Through Hole
Mounting Angle:	Right Angle
Series:	171224
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Brand:	Molex
Color:	Black
Contact Material:	Copper Alloy
Current Rating:	500 mA
Features:	Stacked Ganged Assembly with Metal Spring Fingers, with no light pipes
Flammability Rating:	UL 94 V-0
Housing Material:	Thermoplastic (TP)
Number of Ports:	2 Port
Product Type:	I/O Connectors
Factory Pack Quantity:	90
Subcategory:	I/O Connectors
Type:	zSFP+
Part # Aliases:	01712241001 1712241001
Unit Weight:	23,820 g

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Datasheet

171224-1001 Datasheet

Models

RoHS Certificate (PDF)

TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
BRHTS:: 85366990
ECCN:: EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).