170814-2017

Molex
538-170814-2017
170814-2017

Mfr.:

Description:
Board to Board & Mezzanine Connectors NeoScale High-Speed Rcpt 2.8mm, 6x20, 120 Triads-100Ohm 360 Ckts, H=18mm

Lifecycle:
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Datasheet:
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Product Attribute Attribute Value Select Attribute
Molex
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
170814
Tray
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: SG
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 16
Subcategory: Board to Board & Mezzanine Connectors
Tradename: NeoScale
Part # Aliases: 1708142017 01708142017
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Datasheet

Models

Other

Technical Resources

TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

Board-to-Board Connectors

Molex Board-to-Board Connectors are available in a variety of configurations, offering an expansive array of pitches and stacking heights. The printed circuit board (PCB) is a foundational staple in the electronics industry, and with continuing trends toward miniaturization, designers need a more diverse range of solutions for creating dependable PCB connections. To fit a range of applications, Molex Board-to-Board Connectors include mezzanine, backplane, coplanar, and more. These connectors are ideal for microminiature and high-power applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

NeoScale High-Speed Mezzanine System

Molex NeoScale High-Speed Mezzanine System delivers clean signal integrity at 56Gbps. This system features a high-speed triad wafer design with patented Solder-Charge Technology for customized PCB routing in high-density system applications. Ideal for small footprint designs with limited PCB real estate, the modular NeoScale mezzanine system offers a durable and easily customizable design tool for high-density system applications. Each Molex NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, users can mix and match components to build a mezzanine solution to meet application requirements for signals supporting high-speed differential pairs (85Ω and 100Ω), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.

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