170807-2016

Molex
538-170807-2016
170807-2016

Mfr.:

Description:
Board to Board & Mezzanine Connectors NeoScale Plg 2.80mm 6x12 Gld 22mm Hght

Lifecycle:
Factory Special Order:
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Datasheet:
ECAD Model:
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Availability

Stock:

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Connectors
216 Position
2.8 mm (0.11 in)
6 Row
Vertical
1 A
30 VAC
- 55 C
+ 85 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
170807
Tray
Brand: Molex
Flammability Rating: UL 94 V-0
Mounting Style: Cable
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 72
Subcategory: Board to Board & Mezzanine Connectors
Tradename: NeoScale
Part # Aliases: 1708072016 01708072016
Unit Weight: 21 g
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Attributes selected: 0

Datasheet

Models

Specification Sheets

Compliance Codes
TARIC:
8536693000
CNHTS:
8536690000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99
Origin Classifications
Country of Origin:
Singapore
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Board-to-Board Connectors

Molex Board-to-Board Connectors are available in a variety of configurations, offering an expansive array of pitches and stacking heights. The printed circuit board (PCB) is a foundational staple in the electronics industry, and with continuing trends toward miniaturization, designers need a more diverse range of solutions for creating dependable PCB connections. To fit a range of applications, Molex Board-to-Board Connectors include mezzanine, backplane, coplanar, and more. These connectors are ideal for microminiature and high-power applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

NeoScale High-Speed Mezzanine System

Molex NeoScale High-Speed Mezzanine System delivers clean signal integrity at 56Gbps. This system features a high-speed triad wafer design with patented Solder-Charge Technology for customized PCB routing in high-density system applications. Ideal for small footprint designs with limited PCB real estate, the modular NeoScale mezzanine system offers a durable and easily customizable design tool for high-density system applications. Each Molex NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, users can mix and match components to build a mezzanine solution to meet application requirements for signals supporting high-speed differential pairs (85Ω and 100Ω), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.

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