170340-3038

Molex
538-170340-3038
170340-3038

Mfr.:

Description:
High Speed/Modular Connectors Impact 85 DC 4x8 GL Sn

ECAD Model:
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In Stock: 198

Stock:
198 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 198 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
23,18 € 23,18 €
19,70 € 197,00 €
18,47 € 461,75 €
17,92 € 896,00 €
15,92 € 3.152,16 €
15,21 € 9.034,74 €
1.188 Quote

Product Attribute Attribute Value Select Attribute
Molex
Product Category: High Speed/Modular Connectors
RoHS:  
Receptacles
96 Position
12 Row
1.35 mm, 1.9 mm
Through Hole
Gold
170340
Tray
Brand: Molex
Contact Material: Tin
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: SG
Current Rating: 750 mA
Housing Colour: Gray
Housing Material: Thermoplastic (TP)
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Mounting Angle: Right Angle
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 198
Subcategory: Backplane Connectors
Tradename: Impact
Voltage Rating: 30 V
Unit Weight: 14,391 g
Products found:
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Attributes selected: 0

TARIC:
8536693000
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.