PAC1933T-I/J6CX

Microchip Technology
579-PAC1933T-I/J6CX
PAC1933T-I/J6CX

Mfr.:

Description:
Current & Power Monitors & Regulators PAC1933 Four Channel DC Power Monitor

ECAD Model:
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In Stock: 897

Stock:
897 Can Dispatch Immediately
Factory Lead Time:
6 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 897 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
1,40 € 1,40 €
1,17 € 29,25 €
Full Reel (Order in multiples of 5000)
1,17 € 5.850,00 €

Product Attribute Attribute Value Select Attribute
Microchip
Product Category: Current & Power Monitors & Regulators
RoHS:  
Power Monitors
High Side
5.5 V
2.7 V
585 uA
1 %
- 40 C
+ 85 C
SMD/SMT
WLCSP-16
Reel
Cut Tape
Brand: Microchip Technology
Input Voltage Range: 2.7 V to 5.5 V
Product Type: Current & Power Monitors & Regulators
Series: PAC1933
Factory Pack Quantity: 5000
Subcategory: PMIC - Power Management ICs
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CNHTS:
8542399000
USHTS:
8542390090
ECCN:
EAR99

PAC1932, PAC1933, PAC1934 Power Monitor ICs

Microchip Technology PAC1932, PAC1933, and PAC1934 Power Monitor ICs (PMICs) are multi-channel power and energy monitoring devices. The PAC1932 is a dual-channel power and energy monitor, the PAC1933 features three channels, and the PAC1934 is a quad-channel power monitor. A high-voltage multiplexer sequentially connects the inputs to a bus voltage monitor and current sense amplifier that feed high-resolution ADCs. Digital circuitry performs power calculations and energy accumulation.

Datacom

Microchip Technology Datacom is a comprehensive product portfolio for Data Center infrastructure that includes value-added data center solutions. These solutions include Power Management, Mixed-Signal, Security, Signal Integrity, Timing, FPGAs, MPUs, Co-Processors, and Management software. Microchip Technology is ready to help design, deploy, and manage any data center infrastructure equipment with solutions supporting high densities, low latency, flexibility, compatibility, and scalability.