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LAN8672C2-E/LNX

Name: Microchip LAN8672C2-E/LNX
Brand: Microchip Technology
SKU: 579-LAN8672C2-E/LNX
Price: 3.59 EUR
Availability: InStock

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Mouser No:

579-LAN8672C2-E/LNX

Mfr. No:

LAN8672C2-E/LNX

Mfr.:

Microchip Technology

Description:

Ethernet ICs 10BASE-T1S PHY with MII

Datasheet:

LAN8672C2-E/LNX Datasheet (PDF)

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In Stock: 429

Stock:: 429 Can Dispatch Immediately

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Factory Lead Time:: 6 Weeks Estimated factory production time for quantities greater than shown.

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Qty.	Unit Price	Ext. Price
	3,59 €	3,59 €
	3,00 €	75,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Microchip
Product Category:	Ethernet ICs
RoHS:
Mounting Style:	SMD/SMT
Package/Case:	VQFN-36
Product:	Ethernet PHYs
Standard:	10BASE-T1S
Data Rate:	10 Mb/s
Interface Type:	RMII
Supply Voltage - Min:	3.135 V
Supply Voltage - Max:	3.465 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Tray
Brand:	Microchip Technology
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TH
Duplex:	Half Duplex
Operating Supply Voltage:	3.135 V to 3.465 V
Product Type:	Ethernet ICs
Factory Pack Quantity:	490
Subcategory:	Communication & Networking ICs
Supply Current - Max:	41 mA

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Datasheet

LAN8672C2-E/LNX Datasheet (PDF)

Errata

PCN

Product Change Notification 2025-7-22 (PDF)

USHTS:: 8542390090
ECCN:: EAR99

LAN8670/1/2 10BASE-T1S Ethernet PHY Transceivers

Microchip Technology LAN8670/1/2 10BASE-T1S Ethernet PHY Transceivers are compact, low-power, single-port 10BASE-T1S Ethernet physical layer transceivers. The devices are designed according to the IEEE Std 802.3cg-2019^™ specification. The device provides 10Mbit/s half-duplex transmit and receive capability over a single-balanced pair medium like Unshielded Twisted Pair (UTP) cable. The LAN8670/1/2 is designed for use in applications requiring an extended temperature range (-40°C to +125°C). The device is also compliant with industrial EMC and EMI requirements. The single power supply and simple analog front end simplify its integration into small form factor applications.