MHHDD-15MNS-C1

MH Connectors
587-MHHDD-15MNS-C1
MHHDD-15MNS-C1

Mfr.:

Description:
D-Sub High Density Connectors MHHDD Series, High Density, 15 Positions, Male , Stamped Contact, Nickel Plated Shell, Gold Flash Contact Plating, #4-40UNC 2.50mm inserts

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
16 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
1,22 € 1,22 €
1,03 € 10,30 €
0,989 € 24,73 €
0,929 € 92,90 €
0,845 € 253,50 €
0,761 € 380,50 €
0,676 € 676,00 €
0,634 € 1.585,00 €
0,604 € 3.020,00 €

Product Attribute Attribute Value Select Attribute
MH Connectors
Product Category: D-Sub High Density Connectors
RoHS:  
15 Position
3 Rows
Male
Solder
Straight
Gold
3 A
MHHDD
Tray
Boardlocks: Without
Brand: MH Connectors
Contact Material: Brass
Contact Type: Stamped / Formed
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Insulation: Insulated
Insulation Material: Polybutylene Terephthalate (PBT)
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 55 C
Mounting Style: Through Hole
Pitch: 2.29 mm
Product Type: High Density D-Sub Connectors
Shell Material: Steel
Shell Plating: Nickel
Factory Pack Quantity: 100
Subcategory: D-Sub Connectors
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Attributes selected: 0

USHTS:
8536694040
ECCN:
EAR99

High-Density PCB-Mount D-Sub Connectors

MH Connectors High-Density PCB-Mount D-Sub Connectors are high-density D-Subminiature (D-Sub) connectors in vertical or right-angle orientations with stamped contacts. These PCB-mount D-Subs come in standard high-density sizes and are available in 15 to 78 positions. This MH Connectors series features a 3A current rating and 500VAC withstanding voltage. The connectors feature a glass-filled PBT insulator, a steel shell, and brass contacts plated with gold flash. The series operates over a -55°C to +105°C temperature range and is ideal for a variety of applications, including high-density data communication and space-limited electronic assemblies.