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S015-DIP

Name: M5Stack S015-DIP
Brand: M5Stack
SKU: 170-S015-DIP
Price: 8.94 EUR
Availability: OutOfStock

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See Product Specifications

Mouser No:

170-S015-DIP

Mfr. No:

S015-DIP

Mfr.:

M5Stack

Description:

Specialist Controllers M5StampS3 BAT Module w/ 2.54 Header Pin

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

S015-DIP Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about M5Stack S015-DIP

Availability

Stock:: 0

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On Order:: 20
Factory Lead Time:: 5

Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	8,94 €	8,94 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	M5Stack
Product Category:	Specialist Controllers
RoHS:
Operating Supply Voltage:	3.7 V
Brand:	M5Stack
Maximum Operating Temperature:	+ 40 C
Minimum Operating Temperature:	0 C
Subcategory:	Controllers
Unit Weight:	9,400 g

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Datasheet

S015-DIP Datasheet (PDF)

Compliance Codes

CAHTS:: 8473302000
USHTS:: 8473301180
MXHTS:: 8473300401
ECCN:: 5A992.C

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Stamp-S3Bat & Stamp-S3Bat DIP Core Modules

M5Stack Stamp-S3Bat and Stamp-S3Bat DIP Core Modules come with integrated power management and ESP32-S3-PICO-1-N8R8 as the main control core. These embedded core modules provide 11 GPIOs, 2.4GHz Wi-Fi^®, 8MB flash, 8MB PSRAM, and a 24P BTB connector (supporting the DVP interface). The Stamp-S3Bat and Stamp-S3Bat DIP modules feature a built-in M5MP1 multi-level power control design, power input/output control, lithium battery charging management, and status detection. These modules support external low-power wakeup, an onboard programmable RGB LED, and a 2.54mm standard-pitch half-hole pad design. The Stamp-S3Bat DIP version comes with pre-soldered 2.54mm standard pitch headers, allowing integration into applications via PCB insertion, Dupont cables, or breadboard connection. The Stamp-S3Bat and Stamp-S3Bat DIP modules support both SMT and DIP integration methods, making them ideal for developers to build IoT applications quickly.