TCF350-01180118-020-1PC

LeaderTech
861-TCF3501180118020
TCF350-01180118-020-1PC

Mfr.:

Description:
Thermal Interface Products 30mm*30mm*0.5mm

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 41

Stock:
41 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
99,11 € 99,11 €
90,67 € 906,70 €
86,16 € 2.154,00 €
83,53 € 4.176,50 €
80,74 € 8.074,00 €

Product Attribute Attribute Value Select Attribute
LeaderTech
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Non-standard
35 W/m-K
Gray, Black
- 50 C
+ 180 C
4.72 mm
4.72 mm
TCF
Bulk
Brand: LeaderTech
Product Type: Thermal Interface Products
Factory Pack Quantity: 100
Subcategory: Thermal Management
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

Compliance Codes
TARIC:
6815110000
CAHTS:
6815110000
USHTS:
6815110000
JPHTS:
681511000
KRHTS:
6815110000
BRHTS:
68151100
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

TCF Ultra-Thin Carbon Fibre Thermal Pads

LeaderTech TCF Ultra-Thin Carbon Fibre Thermal Pads offer low thermal resistance and a soft surface. These pads mainly use carbon fibre as a thermally conductive filler by producing the carbon fibre vertically arranged in the polymer matrix. This design forms a thermal conduction path in a vertical direction, which significantly enhances the efficiency level of the heat transfer. LeaderTech TCF Ultra-Thin Carbon Fibre Thermal Pads have a 2-year shelf life and -50°C to +180°C operating temperature range. The TCF series is highly flexible and can replace thermal grease material. Typical applications include graphic processors, base stations, microprocessors and telecommunications.