HI0603O700R-10

Laird Technologies
875-HI0603O700R-10
HI0603O700R-10

Mfr.:

Description:
Ferrite Beads Broadband,1Ln 0603,HI

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 3.700

Stock:
3.700 Can Dispatch Immediately
Factory Lead Time:
10 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 3700 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,241 € 0,24 €
0,169 € 1,69 €
0,146 € 3,65 €
0,131 € 6,55 €
0,116 € 11,60 €
0,099 € 24,75 €
0,088 € 44,00 €
0,077 € 77,00 €
Full Reel (Order in multiples of 4000)
0,061 € 244,00 €

Product Attribute Attribute Value Select Attribute
Laird Technologies
Product Category: Ferrite Beads
RoHS:  
HI
Ferrite Chip Beads
Reel
Cut Tape
Brand: Laird Technologies
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Product Type: Ferrite Beads
Factory Pack Quantity: 4000
Subcategory: Ferrites
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

TARIC:
8504509590
CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
ECCN:
EAR99

Inductive Components

Laird Technologies provides a wide range of inductive components that satisfy multiple design requirements in power systems. Inductive components are a standard set of components in power electronics used in filtering and power regulation. Various inductive components are found in power regulation or power conversion systems, and each component has to be selected such that it helps achieve low-noise, precise regulation, and required isolation to prevent unintended coupling. This broad line of components from Laird helps designers create a custom, flexible solution that addresses multiple EMI problems in power systems without compromising form factor or excessive use of shielding materials.