A18841-07

Laird Technologies
739-A18841-07
A18841-07

Mfr.:

Description:
Thermal Interface Products Tflex SF4 1.75 229x229mm

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
7 Weeks Estimated factory production time.
Minimum: 20   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
74,40 € 1.488,00 €

Product Attribute Attribute Value Select Attribute
Laird Technologies
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Silicone-Free Gap Filler
Non-standard
Silicone
4 W/m-K
Gray (Light Gray)
- 65 C
+ 150 C
229 mm
229 mm
1.75 mm
30 psi
UL 94 V-0
SF4
Bulk
Brand: Laird Technologies
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Designed for: Automotive Electronics, Datacom Systems
Product Type: Thermal Interface Products
Factory Pack Quantity: 1
Subcategory: Thermal Management
Thermal Resistance: 0.07 C/W
Tradename: Tflex
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Attributes selected: 0

USHTS:
3824999397
ECCN:
EAR99

Tflex SF4 Thermal Gap Fillers

Laird Technologies Tflex SF4 Thermal Gap Fillers are silicon-free and offer a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity. These gap fillers provide products with excellent deflection properties, providing minimal pressure on components during deflection. A minimal amount of pressure is required to reach the lowest possible thermal resistance. Laird Technologies Tflex SF4 Thermal Gap Fillers are designed for datacom systems, automotive electronics, optical modules, and cameras.

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.