A18172-10

Laird Technologies
739-A18172-10
A18172-10

Mfr.:

Description:
Thermal Interface Products TPCM 7250

ECAD Model:
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In Stock: 285

Stock:
285
Can Dispatch Immediately
On Order:
264
Expected 7/8/2026
Factory Lead Time:
6
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
29,74 € 29,74 €
27,25 € 272,50 €
25,41 € 508,20 €
23,75 € 1.425,00 €
23,22 € 2.322,00 €
22,98 € 5.974,80 €
16,77 € 8.385,00 €

Product Attribute Attribute Value Select Attribute
Laird Technologies
Product Category: Thermal Interface Products
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Thermoplastic (TP)
7.5 W/m-K
Gray
- 40 C
+ 125 C
228.6 mm
228.6 mm
0.25 mm
UL 94 V-0
Bulk
Brand: Laird Technologies
Product Type: Thermal Interface Products
Size: 9 in x 9 in
Factory Pack Quantity: 20
Subcategory: Thermal Management
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Attributes selected: 0

Compliance Codes
USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99
Origin Classifications
Country of Origin:
United States
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Tpcm™ 7000 High-Performance TIMs

Laird Technologies Tpcm™ 7000 High-Performance Thermal Interface Material (TIM) enhances the cooling of the rigorous thermal challenges in electronics. These TIMs feature a thermal conductivity of 7.5W/mK and provide the lowest thermal resistance by coupling with superior wetting of the mating surfaces and displacing air. Other features are a non-silicone formulation that provides a naturally tacky surface, -40°C to +125°C operating temperature range, and long-term reliability. Within a temperature range of +50°C to +70°C, the initial pad thickness can decrease to a bondline as thin as 35µm. Laird Tpcm 7000 TIMs reliability is shown through exposure to 2000hrs of various aging tests, resulting in proven dependability of +150°C operating temperature. Typical applications include graphic cards, desktops, servers, IGBTs, automotive, memory modules, and game consoles.