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A15325-01

Name: Laird Technologies A15325-01
Brand: Laird Technologies
SKU: 739-A15325-01
Price: 13.7 EUR
Availability: InStock

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Mouser No:

739-A15325-01

Mfr. No:

A15325-01

Mfr.:

Laird Technologies

Description:

Thermal Interface Products Tflex 350 9" x 9"

Datasheet:

A15325-01 Datasheet (PDF)

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Learn more about Laird Technologies A15325-01

In Stock: 77

Stock:: 77 Can Dispatch Immediately

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Factory Lead Time:: 4 Weeks Estimated factory production time for quantities greater than shown.

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Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	13,70 €	13,70 €
	12,55 €	125,50 €
	11,88 €	297,00 €
	11,27 €	563,50 €
	10,65 €	1.065,00 €
	10,11 €	2.527,50 €
	9,72 €	4.860,00 €
	9,68 €	9.680,00 €
2.500	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Laird Technologies
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	Thermal Pad
Package/Case:	Non-standard
Material:	Silicone Elastomer
Thermal Conductivity:	1.2 W/m-K
Breakdown Voltage:	10 kVAC
Color:	Green
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 160 C
Length:	228.6 mm
Width:	228.6 mm
Thickness:	0.89 mm
Tensile Strength:	15 psi
Flammability Rating:	UL 94 V-0
Series:	Tflex 300
Packaging:	Bulk
Brand:	Laird Technologies
Product Type:	Thermal Interface Products
Factory Pack Quantity:	1
Subcategory:	Thermal Management
Tradename:	Tflex
Unit Weight:	165,810 g

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Datasheet

A15325-01 Datasheet (PDF)

Compliance Codes

TARIC:: 8542900000
CNHTS:: 8542900000
CAHTS:: 8546900090
USHTS:: 8542900000
KRHTS:: 8542901000
MXHTS:: 85429001
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.