CSM9MF-25

L-Com
17-CSM9MF-25
CSM9MF-25

Mfr.:

Description:
D-Sub Cables CABLE DB9M/F MOLDED 25'

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
More Information
Learn more about L-Com CSM9MF-25
Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK

In Stock: 10

Stock:
10 Can Dispatch Immediately
Factory Lead Time:
3 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
49,47 € 49,47 €
43,89 € 438,90 €
39,47 € 986,75 €
37,59 € 1.879,50 €
35,80 € 3.580,00 €
34,85 € 8.712,50 €

Product Attribute Attribute Value Select Attribute
L-Com
Product Category: D-Sub Cables
Delivery Restrictions:
 Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK
RoHS:  
Economy Molded D-Sub Cable
DB9
9 Position
DB9
9 Position
Male / Female
26 AWG
25 ft
Gray
Shielded
Brand: L-Com
Jacket Material: Polyvinyl Chloride (PVC)
Product Type: D-Sub Cables
Series: Interconnect
Factory Pack Quantity: 1
Subcategory: Cable Assemblies
Unit Weight: 408,233 g
Products found:
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Attributes selected: 0

Datasheet

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Compliance Codes
TARIC:
8544421000
CNHTS:
8544421100
USHTS:
8544422000
JPHTS:
854442010
BRHTS:
85444200
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Data Interconnect Solutions

L-Com Data Interconnect Solutions consist of D-sub adapters, D-sub cable assemblies, and D-sub connectors. These solutions facilitate high-speed, reliable, secure, and direct connections between two or more data centers, ensuring improved operation and higher performance. Data interconnect products from L-Com offer a wide range of specifications and terminations, enabling engineers to find the ideal solution for a wide range of projects.

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