KTS1289ECAE-TA

Kinetic Technologies
389-KTS1289ECAE-TA
KTS1289ECAE-TA

Mfr.:

Description:
ESD Protection Diodes / TVS Diodes Flat-Clamp Mini TVS for High Voltage Surge & ESD Protection

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
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Learn more about Kinetic Technologies KTS1289ECAE-TA

In Stock: 6.000

Stock:
6.000 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
1,34 € 1,34 €
0,852 € 8,52 €
0,565 € 56,50 €
0,443 € 221,50 €
0,402 € 402,00 €
0,346 € 865,00 €
0,318 € 1.590,00 €
0,313 € 3.130,00 €

Product Attribute Attribute Value Select Attribute
Kinetic Technologies
Product Category: ESD Protection Diodes / TVS Diodes
RoHS:  
Unidirectional
1 Channel
28 V
SMD/SMT
39 V
33.6 V
WLCSP-6
30 kV
30 kV
- 40 C
+ 85 C
KTS1289
Brand: Kinetic Technologies
Pd - Power Dissipation: 1.31 W
Product: TVS Diodes
Subcategory: ESD Protection Diodes / TVS Diodes
Vf - Forward Voltage: - 500 mV
Unit Weight: 6 mg
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Attributes selected: 0

Datasheet

Compliance Codes
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99
Origin Classifications
Country of Origin:
Korea, Republic of
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

KTS1289 Flat-Clamp Mini Monolithic TVS ICs

Kinetic Technologies KTS1289 Flat-Clamp Mini Monolithic Transient Voltage Suppression (TVS) Integrated Circuits (ICs) provide robust TVS protection against Electrostatic Discharge (ESD) and surge events at a system’s USB or other DC power input or output ports. The monolithic ICs include an active-clamp control circuit, a gate driver, and a power MOSFET, providing higher performance in a smaller footprint than typical TVS diodes. The KTS1289 clamps both positive and negative ESD and surge events per IEC standards. The KTS1289 family is packaged in an advanced, fully Green-compliant, 1.66mm x 1.56mm, 6-bump Wafer-Level Chip-Scale Package (WLCSP) or FCDFN22-6 package.    

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