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QSMP-1570

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See Product Specifications

Mouser No:

951-QSMP-1570

Mfr. No:

QSMP-1570

Mfr.:

Ka-Ro electronics

Description:

Computer-On-Modules - COM The factory is currently not taking orders for this product.

Datasheet:

QSMP-1570 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Ka-Ro electronics QSMP-1570

Shipping Alert:

Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK

Availability

Stock:: Non-Stocked, Call To Request a Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Ka-Ro electronics
Product Category:	Computer-On-Modules - COM
Delivery Restrictions:	Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK
RoHS:
Processor Brand:	NXP
Processor Type:	STM32MP157C
Frequency:	200 MHz, 650 MHz
Installed RAM:	512 MB
Cache Memory:	32 kB, 256 kB
Interface Type:	Ethernet, FD-CAN, I2C, MIPI-DSI, SAI, SPI, UART, USB
Minimum Operating Temperature:	- 25 C
Maximum Operating Temperature:	+ 85 C
Dimensions:	27 mm x 27 mm x 2.3 mm
Brand:	Ka-Ro electronics
Flash:	4 GB
Memory Size:	512 MB
Memory Type:	DDR3L
Moisture Sensitive:	Yes
Processor Series:	STM32MP1 Series
Product Type:	Computer-On-Modules - COM
Factory Pack Quantity:	10
Subcategory:	Computing
Unit Weight:	12,838 g

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The factory is currently not accepting orders for this product.

Filter Document:

Datasheet

QSMP-1570 Datasheet (PDF)

Compliance Codes

TARIC:: 8471500000
CAHTS:: 8471500090
USHTS:: 8471500150
JPHTS:: 847150000
MXHTS:: 8471500100
ECCN:: 5A992.C

Origin Classifications

Country of Origin:: Germany
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

QSMP Solder-Down Computer On Module

Ka-Ro Electronics QSMP Solder-Down Computer On Module is small at only 27mm² and a height of 2.3mm. Ka-Ro QSMP Sold-Down module is single-sided assembled and is QFN type lead style with a 1mm pitch and 100 pads. The ground pad additionally acts as a thermal pad.