C2220C944KCRLCAUTO

KEMET
80-C2220C944KCRLAUTO
C2220C944KCRLCAUTO

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 500V 0.94uF X7R 2220 10%

Lifecycle:
New Technology:
Cutting edge technology for the newest designs.
ECAD Model:
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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
575
Expected 10/26/2026
Factory Lead Time:
23
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 300)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
4,27 € 4,27 €
3,07 € 30,70 €
2,60 € 130,00 €
2,45 € 245,00 €
Full Reel (Order in multiples of 300)
2,18 € 654,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Similar Products

Product Attribute Attribute Value Select Attribute
KEMET
Product Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:  
0.94 uF
500 VDC
X7R
10 %
2220
5650
SMD/SMT
Standard
- 55 C
+ 125 C
5.7 mm (0.224 in)
5 mm (0.197 in)
Automotive Grade MLCCs
AEC-Q200
KONNEKT Auto X7R
Reel
Cut Tape
MouseReel
Brand: KEMET
Class: Class 2
Package/Case: 2220 (5650 metric)
Product Type: Ceramic Capacitors
Factory Pack Quantity: 300
Subcategory: Capacitors
Tradename: KONNEKT
Type: X7R Dielectric Automotive Grade MLCC
Unit Weight: 620 mg
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Compliance Codes
TARIC:
8532240000
CNHTS:
8532241000
USHTS:
8532240020
JPHTS:
853224000
BRHTS:
85322410
ECCN:
EAR99
Origin Classifications
Country of Origin:
Mexico
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

KONNEKT™ High-Density Packaging Technology

KEMET KONNEKT™ High-Density Packaging Technology enables components to be bonded together without the use of metal frames, reducing with it the ESR, ESL, and thermal resistance to capacitors. The KEMET KONNEKT technology utilizes innovative transient liquid phase sintering (TLPS) material. The TLPS material has a low-temperature reaction of low melting point metal or alloy, with a high melting point metal or alloy, to form a reacted metal matrix. This process results in a highly conductive bonding material that can be used to connect multiple MLCCs together to form a single surface-mountable component.

X7R Capacitors with KONNEKT™ Technology

KEMET X7R Capacitors with KONNEKT™ Technology feature a 2.4nF to 20µF capacitance range and 25VDC to 3kVDC voltage rating in EIA 1812 or 2220 package sizes. The KONNEKT high-density packaging technology offers an innovative transient liquid phase sintering (TLPS) material that creates a surface-mount, multi-chip solution for high-density packaging. These capacitors are considered temperature stable due to the 125°C maximum operating temperature and are characterized as a Class II material by the EIA. These fixed, ceramic dielectric capacitors are suited for bypass and decoupling applications or for frequency-discriminating circuits where Q and stability of capacitance characteristics are not critical. The X7R boasts a minimal change in capacitance with reference to ambient temperature and the capacitance change is limited to ±15% from -55°C to +125°C.