C1812C943KBGLCAUTO

KEMET
80-C1812C943KBGLAUTO
C1812C943KBGLCAUTO

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 630Vol 0.094uF 1812 C0G w/KONNEKT AECQ2

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
17 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 200)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
3,06 € 3,06 €
1,81 € 18,10 €
1,57 € 157,00 €
Full Reel (Order in multiples of 200)
1,57 € 314,00 €
1,48 € 592,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Similar Products

Product Attribute Attribute Value Select Attribute
KEMET
Product Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:  
0.094 uF
630 VDC
C0G (NP0)
10 %
1812
4532
SMD/SMT
Standard
- 55 C
+ 125 C
4.5 mm (0.177 in)
3.2 mm (0.126 in)
Automotive Grade MLCCs
AEC-Q200
KONNEKT Auto C0G
Reel
Cut Tape
MouseReel
Brand: KEMET
Class: Class 1
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: MX
Package/Case: 1812 (4532 metric)
Product Type: Ceramic Capacitors
Factory Pack Quantity: 200
Subcategory: Capacitors
Type: C0G Dielectric Automotive Grade MLCC
Unit Weight: 110 mg
Products found:
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Attributes selected: 0

Datasheet

Models

PCN

Specification Sheets

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TARIC:
8532240000
CNHTS:
8532241000
CAHTS:
8532240010
USHTS:
8532240020
JPHTS:
853224000
KRHTS:
8532240000
MXHTS:
8532240400
BRHTS:
85322410
ECCN:
EAR99

Power Conversion Solutions

KEMET Power Conversion Solutions includes products designed to meet the demand for higher efficiency and higher power density converters. With the adoption of wide bandgap semiconductors (WBG), resonant converters, and wireless charging, there is a growing need for capacitor solutions as an enabling technology. The increasing trends in power converters require capacitor solutions with low ESR, low inductance, high ripple current handling capability, capacitance stability, and high operating temperatures. By utilizing KEMET's base metal electrode (BME) technology and CaZrO3 dielectric materials, engineers now have access to capacitors that will help increase efficiencies, increase power densities, and drive more power.

KONNEKT™ High-Density Packaging Technology

KEMET KONNEKT™ High-Density Packaging Technology enables components to be bonded together without the use of metal frames, reducing with it the ESR, ESL, and thermal resistance to capacitors. The KEMET KONNEKT technology utilizes innovative transient liquid phase sintering (TLPS) material. The TLPS material has a low-temperature reaction of low melting point metal or alloy, with a high melting point metal or alloy, to form a reacted metal matrix. This process results in a highly conductive bonding material that can be used to connect multiple MLCCs together to form a single surface-mountable component.

C0G Capacitors with KONNEKT™ Technology

KEMET C0G Capacitors with KONNEKT™ Technology feature an operating temperature up to +125°C, 10V to 3000V voltage range, and up to 2.0µF capacitance. KONNKET's high-density packaging technology utilizes an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface-mount multi-chip solution for high-density packaging. Due to their high-temperature tolerance, these C0G capacitors can be mounted close to fast-switching semiconductors in high-power density applications that require minimal cooling. KEMET C0G Capacitors with KONNEKT Technology are ideal for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.

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