C1812C145K5JLC7805

KEMET
80-C1812C145K5JL7805
C1812C145K5JLC7805

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 1.4uF 1812 10% U2J KONNEKT

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 500   Multiples: 500
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
Full Reel (Order in multiples of 500)
2,45 € 1.225,00 €
2,26 € 5.650,00 €
2,11 € 10.550,00 €

Similar Products

Product Attribute Attribute Value Select Attribute
KEMET
Product Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:  
1.4 uF
50 VDC
U2J
10 %
1812
4532
SMD/SMT
Standard
- 55 C
+ 125 C
4.5 mm (0.177 in)
3.2 mm (0.126 in)
General Type MLCCs
KONNEKT Comm U2J
Reel
Brand: KEMET
Class: Class 1
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Package/Case: 1812 (4532 metric)
Product Type: Ceramic Capacitors
Factory Pack Quantity: 500
Subcategory: Capacitors
Tradename: KONNEKT
Type: U2J with KONNEKT Commercial Grade MLCCs
Unit Weight: 110 mg
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Attributes selected: 0

Datasheet

PCN

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TARIC:
8532240000
CNHTS:
8532241000
USHTS:
8532240020
JPHTS:
853224000
BRHTS:
85322410
ECCN:
EAR99

KONNEKT™ U2J Capacitors for Power Applications

KEMET KONNEKT™ U2J surface-mount capacitors are designed for high-efficiency and high-density power applications. KONNEKT utilizes an innovative Transient Liquid Phase Sintering (TLPS) material, creating a leadless multi-chip solution. When combined with KEMET's ultrastable U2J dielectric, KONNEKT enables a low-loss, low-inductance package capable of handling extremely high ripple currents in the hundreds of KHz. U2J capacitors are built with extremely stable Class I dielectric material that exhibits a negligible shift in capacitance with respect to voltage and a predictable and linear change in capacitance with reference to ambient temperature, with a minimal aging effect. The capacitance change is limited to -750±120ppm/°C from -55°C to +125°C. KEMET U2J KONNEKT can be mounted in a low-loss orientation to further increase its power handling capability. The low-loss orientation lowers ESR and ESL, increasing ripple current handling capability. These capacitors are designed for high-efficiency and high-density power applications.

KONNEKT™ High-Density Packaging Technology

KEMET KONNEKT™ High-Density Packaging Technology enables components to be bonded together without the use of metal frames, reducing with it the ESR, ESL, and thermal resistance to capacitors. The KEMET KONNEKT technology utilizes innovative transient liquid phase sintering (TLPS) material. The TLPS material has a low-temperature reaction of low melting point metal or alloy, with a high melting point metal or alloy, to form a reacted metal matrix. This process results in a highly conductive bonding material that can be used to connect multiple MLCCs together to form a single surface-mountable component.

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