C0603X104K5RALTU

KEMET
80-C0603X104K5RAL
C0603X104K5RALTU

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 0.1uF 0603 X7R 0.1

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Availability

Stock:
Non-Stocked
Factory Lead Time:
52 Weeks Estimated factory production time.
Long lead time reported on this product.
Minimum: 4000   Multiples: 4000
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
Full Reel (Order in multiples of 4000)
0,503 € 2.012,00 €

Similar Products

Product Attribute Attribute Value Select Attribute
KEMET
Product Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:  
0.1 uF
50 VDC
X7R
10 %
0603
1608
SMD/SMT
Flexible (Soft)
- 55 C
+ 125 C
1.6 mm (0.063 in)
0.8 mm (0.031 in)
0.8 mm (0.031 in)
General Type MLCCs
SMD Comm X7R Flex
Reel
Brand: KEMET
Class: Class 2
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: MX
Package/Case: 0603 (1608 metric)
Product Type: Ceramic Capacitors
Factory Pack Quantity: 4000
Subcategory: Capacitors
Tradename: FT-CAP
Type: Surface Mount Multilayer Ceramic Chip Capacitor
Part # Aliases: C0603X104K5RAL7867
Unit Weight: 6,300 mg
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TARIC:
8532240000
CNHTS:
8532241000
CAHTS:
8532240010
USHTS:
8532240020
JPHTS:
853224000
KRHTS:
8532240000
BRHTS:
85322410
ECCN:
EAR99

Flexible Termination (FT-CAP) MLCCs

KEMET Flexible Termination (FT-CAP) multilayer ceramic chip capacitors (MLCCs) offer a unique, flexible termination system that is integrated with KEMET's standard termination materials. The flexible termination technology combats flex cracking, which is the primary failure mode of MLCCs, and directs board flex stress away from the ceramic body and into the termination area, mitigating flex cracks that can lead to low IR and short circuit failures. This technology also provides superior flex performance (up to 5mm) over standard termination systems. The high-voltage FT-CAP MLCCs provide a voltage range of 500VDC to 3000VDC. The Flex Term X8L MLCCs have a high operating temperature of up to 150°C. Flexible Termination C0G MLCCs offer superior flex performance (up to 5mm), a capacitance range from 0.5pF to 0.47µF, and a voltage range from 10V to 200V.

Group Power Conversion Components

YAGEO Group (YAGEO, Pulse, KEMET) designs passive component technologies that are critical in power conversion systems, including safety, snubber, and DC link capacitors; current sense and power resistors; and magnetic components such as transformers, common mode chokes, and inductors. Because every electronic device requires power, a vast majority of these products utilize a form of power conversion or power supply to deliver the required energy. 

Flexible Termination MLCCs

KEMET Flexible Termination technology is utilized in several series of surface-mount Multilayer Ceramic Chip Capacitors (MLCCs). These capacitors were developed to address flex cracks, the industry's primary failure mode for MLCCs. The Flexible termination directs circuit board stress away from the ceramic body and into the termination area. These MLCCs reduce the risk of mechanical damage to the component that can result in low IR and short circuit failures.

Flexible Mitigation Surface Mount ≤250V MLCCs

KEMET Flexible Mitigation Surface Mount ≤250V MLCCs are solutions designed to reduce the risk of flex cracks. These solutions include the following: Flexible Termination (FT-CAP), Floating Electrode (FE-CAP), and Open Mode (FO-CAP) Technology. 

High CV Multilayer Ceramic Capacitors (MLCCs)

KEMET High CV Multilayer Ceramic Capacitors (MLCCs) are a preferred capacitance solution, offering tremendous performance, reliability, and cost advantages for circuit designers. Ceramics are non-polar devices that offer unsurpassed volumetric efficiency, delivering high capacitance in small package sizes. Available in a wide range of sizes, KEMET High CV MLCCs offer very low equivalent series resistance (ESR), exhibit excellent high-frequency characteristics, and are very reliable. MLCCs are monolithic devices that consist of laminated layers of specially formulated ceramic dielectric materials interspersed with a metal electrode system. The layered formation is then fired at a high temperature to produce a sintered and volumetrically efficient capacitance device. A conductive termination barrier system is integrated into the exposed ends of the chip to complete the connection.