IM2G16D3FDBG-125I

Intelligent Memory
822-IM2G16D3FDBG125I
IM2G16D3FDBG-125I

Mfr.:

Description:
DRAM DDR3 2Gb, 1.35V/1.5V, 128Mx16, 800MHz (1600Mbps), -40C to +95C, FBGA-96

Datasheet:
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.
More Information
Learn more about Intelligent Memory IM2G16D3FDBG-125I

In Stock: 231

Stock:
231 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
11,52 € 11,52 €
10,70 € 107,00 €
10,37 € 259,25 €
10,12 € 506,00 €
9,87 € 987,00 €
9,55 € 1.890,90 €
9,31 € 5.530,14 €
9,07 € 10.775,16 €
2.574 Quote

Product Attribute Attribute Value Select Attribute
Intelligent Memory
Product Category: DRAM
RoHS:  
SDRAM - DDR3L
2 Gbit
16 bit
800 MHz
FBGA-96
128 M x 16
20 ns
1.283 V
1.45 V
- 40 C
+ 95 C
IM2G16D3
Tray
Brand: Intelligent Memory
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Product Type: DRAM
Factory Pack Quantity: 198
Subcategory: Memory & Data Storage
Supply Current - Max: 240 mA
Unit Weight: 166 mg
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

Datasheet

CAHTS:
8542320020
USHTS:
8542320036
MXHTS:
8542320299
ECCN:
EAR99

Double Data Rate 3 (DDR3) DRAM

Intelligent Memory Double Data Rate 3 (DDR3) DRAM provides 1Gb to 16Gb densities for commercial and industrial applications. These ICs support Off-Chip Driver (OCD) impedance and On-Die Termination (ODT). The Intelligent Memory DDR3 DRAM features write leveling, programmable burst lengths, and CAS latency in FBGA-78 and FBGA-96 packages.

Dynamic Random Access Memory (DRAM)

Intelligent Memory Dynamic Random Access Memory (DRAM) includes a full range of JEDEC-compliant DRAMs and ECC DRAMs (SDRAM, DDR, DDR2, DDR3, DDR4, LPDDR4). From an application's point of view, these components work like a monolithic device. The DRAM devices allow for maximum levels of memory density without altering existing board layouts or designs.

An unexpected error has occurred.


Have a question? Please visit the Help Centre.
For questions about a specific order, please log in to your account.

If you encounter further problems, please contact us on 800-346-6873 or email help@mouser.com.