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S26KL512SDABHV030

Name: Infineon S26KL512SDABHV030
Brand: Infineon Technologies
SKU: 727-26KL512SDABHV030
Price: 12.98 EUR
Availability: InStock

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Mouser No:

727-26KL512SDABHV030

Mfr. No:

S26KL512SDABHV030

Mfr.:

Infineon Technologies

Description:

NOR Flash HYPERFLASH

Datasheet:

S26KL512SDABHV030 Datasheet (PDF)

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In Stock: 25

Stock:: 25 Can Dispatch Immediately

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Factory Lead Time:: 10 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	12,98 €	12,98 €
	12,04 €	120,40 €
	11,66 €	291,50 €
	10,39 €	519,50 €
	8,92 €	4.460,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	NOR Flash
RoHS:
Mounting Style:	SMD/SMT
Package/Case:	FBGA-24
Series:	S26KL/S26KS
Memory Size:	512 Mbit
Supply Voltage - Min:	2.7 V
Supply Voltage - Max:	3.6 V
Active Read Current - Max:	180 mA
Interface Type:	Parallel
Maximum Clock Frequency:	100 MHz
Organisation:	64 M x 8
Data Bus Width:	8 bit
Timing Type:	Synchronous
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Tray
Brand:	Infineon Technologies
Moisture Sensitive:	Yes
Product Type:	NOR Flash
Speed:	100 MHz
Factory Pack Quantity:	676
Subcategory:	Memory & Data Storage
Tradename:	HyperFlash

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Datasheet

S26KL512SDABHV030 Datasheet (PDF)

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TARIC:: 8542326100
CNHTS:: 8542319090
CAHTS:: 8542320040
USHTS:: 8542320051
JPHTS:: 854232039
KRHTS:: 8542321090
MXHTS:: 8542320201
ECCN:: 3A991.b.1.a

HYPERFLASH™ NOR Flash Memory

Infineon Technologies HYPERFLASH NOR Flash Memory is based on the Infineon HYPERBUS™ Interface, which allows for read throughput of up to 333MB/s. HYPERFLASH uses a small 8x6mm ball grid array (BGA) package sharing a common footprint with Quad SPI and Dual-Quad SPI parts to simplify board layout. The Infineon HYPERFLASH NOR Flash Memory is ideal for high-performance applications, such as automotive instrument clusters, communication systems, industrial automation, and medical equipment, which require very high read bandwidth to enable a fast boot time for instant-on requirements, along with a low pin-count interface to reduce package size and PCB cost.