GS66504B-MR

499-GS66504B-MR
GS66504B-MR

Mfr.:

Description:
GaN FETs LEGACY GAN SYSTEMS

Lifecycle:
End of Life:
Scheduled for obsolescence and will be discontinued by the manufacturer.
ECAD Model:
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In Stock: 3.231

Stock:
3.231 Can Dispatch Immediately
Quantities greater than 3231 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 250)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
12,58 € 12,58 €
9,39 € 93,90 €
8,12 € 812,00 €
Full Reel (Order in multiples of 250)
8,12 € 2.030,00 €
7,69 € 3.845,00 €
6,54 € 6.540,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Alternative Packaging

Mfr. Part No.:
Packaging:
Reel, Cut Tape, MouseReel
Availability:
In Stock
Price:
12,59 €
Min:
1

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: GaN FETs
RoHS:  
SMD/SMT
GaNpx
N-Channel
1 Channel
650 V
15 A
130 mOhms
- 10 V, + 7 V
1.1 V
3.3 nC
- 55 C
+ 150 C
Enhancement
GaNPX
Brand: Infineon Technologies
Configuration: Single
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Development Kit: GS665MB-EVB, GS-EVB-ACDC-300W-ON
Maximum Operating Frequency: 10 MHz
Minimum Operating Frequency: 0 Hz
Moisture Sensitive: Yes
Packaging: Reel
Packaging: Cut Tape
Packaging: MouseReel
Product Type: GaN FETs
Series: GS665xx
Factory Pack Quantity: 250
Subcategory: Transistors
Technology: GaN-on-Si
Transistor Type: E-Mode
Part # Aliases: GS66504B-E01-MR
Unit Weight: 14,594 g
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CNHTS:
8541290000
USHTS:
8541290065
ECCN:
EAR99

GS665xx Enhancement-Mode Silicon Power Transistors

Infineon Technologies GS665xx Enhancement-Mode High Electron Mobility Transistors (E-HEMT) feature high current, high voltage breakdown, and high switching frequency. These power transistors include Island Technology cell layout with high-current die and high yield, and GaNPX®  small packaging enables low inductance and low thermal resistance. These power transistors offer very low junction-to-case thermal resistance for high-power applications. The GS665xx enhancement-mode silicon power transistors are available as bottom-sided or top-sided cooled transistors. These power transistors provide ultra-low FOM die, reverse current capability, and zero reverse recovery loss.