FS100R12W2T7BOMA1

Infineon Technologies
726-FS100R12W2T7BOMA
FS100R12W2T7BOMA1

Mfr.:

Description:
IGBT Modules 1200 V, 100 A sixpack IGBT module

Datasheet:
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In Stock: 154

Stock:
154 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
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Pricing (EUR)

Qty. Unit Price
Ext. Price
57,36 € 57,36 €
49,95 € 499,50 €

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: IGBT Modules
IGBT Silicon Modules
6-Pack
1.2 kV
1.5 V
70 A
100 nA
- 40 C
+ 175 C
Tray
Brand: Infineon Technologies
Maximum Gate Emitter Voltage: 20 V
Mounting Style: Screw Mount
Product Type: IGBT Modules
Series: Trenchstop IGBT7
Factory Pack Quantity: 15
Subcategory: IGBTs
Technology: Si
Tradename: EasyPACK
Part # Aliases: FS100R12W2T7 SP005351618
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Compliance Codes
TARIC:
8541290000
CNHTS:
8504409100
USHTS:
8541290065
ECCN:
EAR99
Origin Classifications
Country of Origin:
Germany
Assembly Country of Origin:
China
Country of Diffusion:
Austria
The country is subject to change at the time of shipment.

EasyPACK™ 2B IGBT Power Modules

Infineon Technologies EasyPACK™ 2B IGBT Power Modules are a scalable power module solution with a flexible pin grid system perfect for customizing layout and pinout. The packages do not have a base plate, enabling use in various applications. In PIM or Six-Pack configurations, the Infineon EasyPACK 2B IGBT power modules cover the full power range from 20A to 200A at 600V/650V/1200V. These modules also have a power dissipation range from 20mW to 600W and operate from -40°C up to +150°C or +175°C.

FS100R12W2T7_B11 EasyPIM™ 2B IGBT Module

FS100R12W2T7_B11 EasyPIM™ 2B IGBT Module is a 1200V, 100A three-phase input rectifier PIM (Power Integrated Module) Insulated Gate Bipolar Transistor Module with TRENCHSTOP™ IGBT7, an Emitter Controlled Diode, and PressFIT Contact Technology. The compact EasyPIM IGBT Modules are without base plates, instead featuring a fast, reliable, and low-cost screw clamp mount. 

TRENCHSTOP™ IGBT7 Discretes & Modules

Infineon Technologies TRENCHSTOP™ IGBT7 Discretes and Modules are designed for variable-speed drives. If only half of all industrial drives had electric speed control, 20% of energy or 17 million tons of CO2 could be saved. Infineon facilitates this switch with the TRENCHSTOP IGBT7 technology.

EasyPIM™ IGBT Module

Infineon Technologies EasyPIM™ IGBT Module is a 3-phase input rectifier PIM IGBT module with TRENCHSTOP™ IGBT7, emitter controlled 7 diode, and NTC/PressFIT technology. This module features enhanced controllability of dv/dt, improved FWD softness, optimised switching losses, and 8µs short-circuit robustness. The EasyPIM (Power Integrated Module) is very small in size, which helps in attaining higher power density. This module lowers system cost and losses to meet energy efficiency requirements. Typical applications include auxiliary inverters, air conditioning, servo motors, and heating ventilation and air conditioning (HVAC).

1200V Sixpack IGBT Modules

Infineon 1200V Sixpack IGBT Modules are EasyPACK™ 1B sixpack IGBT modules with TRENCHSTOP™ IGBT7, Emitter Controlled 7 diode, and NTC technology. This technology strongly reduces losses and provides a high level of controllability. The cell concept is characterized by implementing parallel trench cells separated by sub-micron mesas compared to the formerly used square trench cells. The chip is specially optimized for industrial drive applications and solar energy systems, which means much lower static losses, higher power density, and softer switching. A significant increase in power density can be obtained by raising the allowed maximum operating temperature up to 175°C in the Infineon 1200V Sixpack IGBT Modules.

EasyPACK™ 2B Automotive Power Modules

Infineon Technologies EasyPACK™ 2B Automotive Power Modules offer a 1200V voltage rating, TRENCHSTOP™ technology, and overload operation up to +175°C. These EasyPACK 2B modules provide a platform for different power classes using Si IGBT and CoolSIC™ technologies and feature a flexible package for easy customization to fit the designer's needs due to the ability to add other chip technologies in different topologies. These modules feature housing with integrated mounting clamps to ensure the right pressure of the module to the cooling system over the whole lifetime. Infineon Technologies EasyPACK 2B Automotive Power Modules are designed for hybrid and electric vehicle applications.

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