CYW20721B1KUMLG

Infineon Technologies
727-CYW20721B1KUMLG
CYW20721B1KUMLG

Mfr.:

Description:
RF Microcontrollers - MCU /BLE/IEEE 802.15.4

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
13 Weeks Estimated factory production time.
Minimum: 4900   Multiples: 4900
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
4,69 € 22.981,00 €

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: RF Microcontrollers - MCU
QFN-40
SMD/SMT
Tray
Brand: Infineon Technologies
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Moisture Sensitive: Yes
Product Type: RF Microcontrollers - MCU
Series: CYW20721
Factory Pack Quantity: 4900
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
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Attributes selected: 0

CNHTS:
8542319090
CAHTS:
8542310000
USHTS:
8542310050
MXHTS:
8542310302
ECCN:
5A992.C

IoT BLUETOOTH® Modules

Infineon Technologies IoT BLUETOOTH® Modules provide the broadest BLUETOOTH® module portfolio for various next-generation IoT applications. These modules are fully certified, fully integrated, programmable modules designed for ease of use with Dual-Mode and BLE-only options available. Whether an IoT design requires a small module footprint, extended operating temperature, cost-optimization, or long-range communication, Cypress can provide a BLUETOOTH® Module solution to reduce time-to-market for developers.

CYW20721 BR/EDR/BLE BLUETOOTH® 5.0 SoCs

Infineon Technologies CYW20721 BR/EDR/BLE BLUETOOTH® 5.0 System-on-Chip (SoC) modules are Bluetooth 5.0-compliant, stand-alone baseband processors with an integrated 2.4GHz transceiver, implementing Bluetooth Low Energy, EDR, and BR. These modules are manufactured using an advanced 40nm CMOS low-power fabrication process, which employs a high level of integration, reducing external components that minimize application footprint and costs. Infineon Technologies CYW20721 BR/EDR/BLE BLUETOOTH® 5.0 SoCs are ideally suited for use in audio, the Internet of Things (IoT), sensors, and human interface device (HID) applications.