IS63WV1288DBLL-10HLI

ISSI
870-63WV1288DBLL10HL
IS63WV1288DBLL-10HLI

Mfr.:

Description:
SRAM 1Mb (128Kx8) 10ns Async SRAM 3.3v

Datasheet:
ECAD Model:
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More Information
Learn more about ISSI IS63WV1288DBLL-10HLI
This product may require additional documentation to export from the United States.

Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
234
Expected 9/4/2026
Factory Lead Time:
16
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
4,44 € 4,44 €
4,14 € 41,40 €
4,02 € 100,50 €
3,92 € 196,00 €
3,83 € 383,00 €
3,71 € 868,14 €
3,61 € 1.689,48 €
3,53 € 4.130,10 €

Product Attribute Attribute Value Select Attribute
ISSI
Product Category: SRAM
Delivery Restrictions:
 This product may require additional documentation to export from the United States.
RoHS:  
1 Mbit
128 k x 8
10 ns
Parallel
3.6 V
2.4 V
55 mA
- 40 C
+ 85 C
SMD/SMT
Tray
Brand: ISSI
Moisture Sensitive: Yes
Product Type: SRAM
Series: IS63WV1288DBLL
Factory Pack Quantity: 234
Subcategory: Memory & Data Storage
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Attributes selected: 0

Datasheet

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Compliance Codes
TARIC:
8542324500
CNHTS:
8542329010
CAHTS:
8542320030
USHTS:
8542320041
JPHTS:
854232019
KRHTS:
8542321020
MXHTS:
8542320299
ECCN:
3A991.b.2.b
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Asynchronous SRAMs

ISSI Asynchronous SRAMs are offered in x8, x16, and x32 configurations. These devices are available in high-speed, low-power, high-speed/low-power, PowerSaver lower power, and automotive versions with long-term support offered by ISSI's commitment to the continued development of these products. ISSI Asynchronous SRAMs feature a wide offering of densities (64K to 16M), speeds (8ns to 55ns), supply voltages (1.65V to 5V), and temperature ranges (commercial, industrial, and automotive). These devices are available in a variety of packages (BGA, SOJ, SOP, sTSOP, and TSOP) to fit a variety of design needs.

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