IS61WV6416EEBLL-10TLI

ISSI
870-61WV641EBLL10TLI
IS61WV6416EEBLL-10TLI

Mfr.:

Description:
SRAM 1M, 2.4V-3.6V, 10ns LP Async SRAM

Lifecycle:
NRND:
Not recommended for new designs.
Datasheet:
ECAD Model:
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More Information
Learn more about ISSI IS61WV6416EEBLL-10TLI
This product may require additional documentation to export from the United States.

Availability

Stock:
Non-Stocked
Factory Lead Time:
16 Weeks Estimated factory production time.
Minimum: 135   Multiples: 135
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
4,15 € 560,25 €
4,06 € 1.096,20 €
4,01 € 2.165,40 €
3,95 € 4.266,00 €

Product Attribute Attribute Value Select Attribute
ISSI
Product Category: SRAM
Delivery Restrictions:
 This product may require additional documentation to export from the United States.
RoHS:  
1 Mbit
64 k x 16
10 ns
Parallel
3.6 V
2.4 V
25 mA
- 40 C
+ 85 C
SMD/SMT
TSOP-44
Tray
Brand: ISSI
Memory Type: Asynchronous CMOS
Moisture Sensitive: Yes
Product Type: SRAM
Series: IS61WV6416EEBLL
Factory Pack Quantity: 135
Subcategory: Memory & Data Storage
Type: Asynchronous
Unit Weight: 470 mg
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Attributes selected: 0

Datasheet

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Compliance Codes
TARIC:
8542324500
CNHTS:
8542319090
CAHTS:
8542320041
USHTS:
8542320041
JPHTS:
854232019
KRHTS:
8542321020
MXHTS:
8542320201
ECCN:
3A991.b.2.b
Origin Classifications
Country of Origin:
Taiwan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Asynchronous SRAMs

ISSI Asynchronous SRAMs are offered in x8, x16, and x32 configurations. These devices are available in high-speed, low-power, high-speed/low-power, PowerSaver lower power, and automotive versions with long-term support offered by ISSI's commitment to the continued development of these products. ISSI Asynchronous SRAMs feature a wide offering of densities (64K to 16M), speeds (8ns to 55ns), supply voltages (1.65V to 5V), and temperature ranges (commercial, industrial, and automotive). These devices are available in a variety of packages (BGA, SOJ, SOP, sTSOP, and TSOP) to fit a variety of design needs.

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