IT3-100P-35H(03)

Hirose Connector
798-IT3-100P-35H03
IT3-100P-35H(03)

Mfr.:

Description:
Board to Board & Mezzanine Connectors

Datasheet:
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Learn more about Hirose Connector IT3-100P-35H(03)

Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 25   Multiples: 25
Unit Price:
-,-- €
Ext. Price:
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Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
30,69 € 767,25 €

Product Attribute Attribute Value Select Attribute
Hirose Electric
Product Category: Board to Board & Mezzanine Connectors
IT3
Tray
Brand: Hirose Connector
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 25
Subcategory: Board to Board & Mezzanine Connectors
Part # Aliases: 636-0239-4-03
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Datasheet

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Compliance Codes
USHTS:
8536694040
Origin Classifications
Country of Origin:
Malaysia
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

IT3 High-Speed BGA Mezz Connectors

Hirose IT3 High-Speed BGA Mezz Connectors transmit differential, single-ended, and power through one package. The stackable IT3 series (ranging from 15mm to 40mm) provides reliable connections for today's data rates, including PCIe and XAUI, as well as 10+ Gbps systems. Hirose IT3 High-Speed BGA Mezz Connectors offer a staggered 1.5mm x 1.75mm ball grid array. Additional features include 100, 200, and 300 contacts (+90% additional grounds), low mating/extracting forces, wide misalignment tolerances for multiple connector use, and excellent reflow solderability. The IT3 system features three basic components: the mating receptacle, the interposer, and the mounting receptacle. The mating and mounting receptacles are reflowed to the PCB, and different height interposer assemblies are selected to achieve the needed height between the PCBs.

Medical Solutions

Hirose Electric Medical Solutions include high-performance connectors engineered for precision, durability, and reliability in demanding applications. Products offered include board-to-board, wire-to-board, FPC/FFC, circular, and coaxial connectors with IP67/IP68 sealing to protect against debris, dust, and moisture ingress. Features include EMI shielding, extended mating cycles, and secure locking, ensuring stable interference-free performance. The miniaturized products from Hirose support compact, high-density systems, while hybrid signal/power designs and RoHS/IEC compliance meet the evolving needs of diagnostic imaging, patient monitoring, therapy systems, and wearable medical tech.

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