1210AS-R33J-01

Fastron
434-1210AS-R33J-01
1210AS-R33J-01

Mfr.:

Description:
RF Inductors - SMD RF CHIP INDUCTORS

Datasheet:
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In Stock: 469

Stock:
469 Can Dispatch Immediately
Factory Lead Time:
9 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 800)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,421 € 0,42 €
0,355 € 3,55 €
0,326 € 8,15 €
0,264 € 26,40 €
0,249 € 62,25 €
0,207 € 103,50 €
Full Reel (Order in multiples of 800)
0,175 € 140,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fastron
Product Category: RF Inductors - SMD
RoHS:  
Wirewound
1210 (3225 metric)
Unshielded
330 nH
5 %
680 mA
490 mOhms
- 40 C
+ 125 C
45
500 MHz
Standard
3.8 mm
3 mm
2.4 mm
Ceramic
AEC-Q200
1210AS
Reel
Cut Tape
MouseReel
Application: RF
Brand: Fastron
Case Code - in: 1210
Case Code - mm: 3225
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 800
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
Test Frequency: 25 MHz
Unit Weight: 50 mg
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Attributes selected: 0

Datasheet

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TARIC:
8504500090
CNHTS:
8504500000
CAHTS:
8504500000
USHTS:
8504508000
JPHTS:
850450000
KRHTS:
8504502090
MXHTS:
8504509199
BRHTS:
85045000
ECCN:
EAR99

RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.

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