0805AS-027J-01

Fastron
434-0805AS-027J-01
0805AS-027J-01

Mfr.:

Description:
RF Inductors - SMD Ceramic Core Chip Inductor

Datasheet:
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In Stock: 2.351

Stock:
2.351 Can Dispatch Immediately
Factory Lead Time:
9 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 2351 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2500)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,292 € 0,29 €
0,247 € 2,47 €
0,228 € 5,70 €
0,176 € 17,60 €
0,168 € 42,00 €
0,132 € 132,00 €
Full Reel (Order in multiples of 2500)
0,112 € 280,00 €
0,105 € 525,00 €
0,10 € 1.000,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fastron
Product Category: RF Inductors - SMD
RoHS:  
Wirewound
0805 (2012 metric)
Unshielded
27 nH
5 %
500 mA
250 mOhms
- 40 C
+ 150 C
55
2.5 GHz
Standard
2.3 mm
1.8 mm
1.6 mm
Ceramic
AEC-Q200
0805AS
Reel
Cut Tape
MouseReel
Application: RF
Brand: Fastron
Case Code - in: 0805
Case Code - mm: 2012
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 2500
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
Unit Weight: 10 mg
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Attributes selected: 0

Datasheet

Application Notes

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TARIC:
8504509590
CNHTS:
8504500000
USHTS:
8504508000
ECCN:
EAR99

RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.

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