2522195518G4

Fair-Rite
623-2522195518G4
2522195518G4

Mfr.:

Description:
Ferrite Beads 2219 Case Size Multilayer Chip Bead

Datasheet:
ECAD Model:
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More Information
Learn more about Fair-Rite 2522195518G4

In Stock: 151

Stock:
151
Can Dispatch Immediately
On Order:
4.000
Expected 6/29/2026
Factory Lead Time:
20
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
1,69 € 1,69 €
1,17 € 11,70 €
0,998 € 24,95 €
0,886 € 44,30 €
0,772 € 77,20 €
0,675 € 168,75 €
0,649 € 649,00 €
Full Reel (Order in multiples of 2000)
0,649 € 1.298,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fair-Rite
Product Category: Ferrite Beads
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
2219 (5650 metric)
550 Ohms
250 mA
25 %
1.2 Ohms
- 55 C
+ 125 C
5.59 mm
5.08 mm
1.97 mm
Reel
Cut Tape
MouseReel
Brand: Fair-Rite
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Number of Channels: 1 Channel
Number of Elements: 2 Element
Product Type: Ferrite Beads
Shielding: Shielded
Factory Pack Quantity: 2000
Subcategory: Ferrites
Type: Multilayer Chip Bead
Products found:
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Attributes selected: 0

Datasheet

TARIC:
8504509590
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
ECCN:
EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.

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