2512063017Y3

Fair-Rite
623-2512063017Y3
2512063017Y3

Mfr.:

Description:
Ferrite Beads MULTILAYER CHIP BEAD Z=300 OHM@100MHz 25

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Learn more about Fair-Rite 2512063017Y3

Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
56.791
Expected 6/29/2026
Factory Lead Time:
20
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 3000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,146 € 0,15 €
0,104 € 1,04 €
0,091 € 2,28 €
0,082 € 4,10 €
0,073 € 7,30 €
0,063 € 15,75 €
0,056 € 28,00 €
0,04 € 40,00 €
Full Reel (Order in multiples of 3000)
0,04 € 120,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Similar Products

Product Attribute Attribute Value Select Attribute
Fair-Rite
Product Category: Ferrite Beads
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
1206 (3216 metric)
300 Ohms
3 A
25 %
60 mOhms
- 55 C
+ 125 C
3.2 mm
1.6 mm
1.1 mm
Reel
Cut Tape
MouseReel
Brand: Fair-Rite
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Product Type: Ferrite Beads
Factory Pack Quantity: 3000
Subcategory: Ferrites
Test Frequency: 100 MHz
Type: Multilayer Ferrite Chip Bead
Unit Weight: 10 mg
Products found:
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Attributes selected: 0

TARIC:
8504509590
CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
MXHTS:
85049099
ECCN:
EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.

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