2508053017Y0

Fair-Rite
623-2508053017Y0
2508053017Y0

Mfr.:

Description:
Ferrite Beads MultLyr Chip Bead 300 OHM 0805 300mA

Datasheet:
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Learn more about Fair-Rite 2508053017Y0

In Stock: 74.656

Stock:
74.656 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,086 € 0,09 €
0,061 € 0,61 €
0,047 € 1,18 €
0,039 € 3,90 €
0,034 € 8,50 €
0,029 € 14,50 €
0,027 € 27,00 €
Full Reel (Order in multiples of 4000)
0,019 € 76,00 €
0,018 € 144,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fair-Rite
Product Category: Ferrite Beads
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
0805 (2012 metric)
300 Ohms
300 mA
25 %
250 mOhms
- 55 C
+ 125 C
2 mm
1.25 mm
0.9 mm
Reel
Cut Tape
MouseReel
Brand: Fair-Rite
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Product Type: Ferrite Beads
Shielding: Unshielded
Factory Pack Quantity: 4000
Subcategory: Ferrites
Test Frequency: 100 MHz
Type: Multilayer Ferrite Chip Bead
Unit Weight: 5,500 mg
Products found:
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Attributes selected: 0

Datasheet

TARIC:
8504509590
CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
MXHTS:
85049099
ECCN:
EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.

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