2504026017Y0

Fair-Rite
623-2504026017
2504026017Y0

Mfr.:

Description:
Ferrite Beads MultLyr Chip Bead 0402 600 OHM 50mA

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Learn more about Fair-Rite 2504026017Y0

In Stock: 47.010

Stock:
47.010 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 10000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,172 € 0,17 €
0,126 € 1,26 €
0,109 € 2,73 €
0,098 € 4,90 €
0,088 € 8,80 €
0,075 € 18,75 €
0,066 € 33,00 €
0,058 € 58,00 €
0,045 € 180,00 €
Full Reel (Order in multiples of 10000)
0,045 € 450,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fair-Rite
Product Category: Ferrite Beads
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
0402 (1005 metric)
600 Ohms
50 mA
25 %
1.1 Ohms
- 55 C
+ 125 C
1 mm
0.5 mm
0.5 mm
Reel
Cut Tape
MouseReel
Brand: Fair-Rite
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Product Type: Ferrite Beads
Factory Pack Quantity: 10000
Subcategory: Ferrites
Test Frequency: 100 MHz
Type: Multilayer Ferrite Chip Bead
Part # Aliases: 2504026017Y0L
Unit Weight: 0,650 mg
Products found:
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Attributes selected: 0

TARIC:
8504509590
CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
MXHTS:
85049099
ECCN:
EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.

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