2504021007Y0

Fair-Rite
623-2504021007Y0
2504021007Y0

Mfr.:

Description:
Ferrite Beads Multi-Layer ChipBead 10Ohm 25% 100MHz

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Learn more about Fair-Rite 2504021007Y0

In Stock: 22.685

Stock:
22.685 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 10000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,155 € 0,16 €
0,112 € 1,12 €
0,097 € 2,43 €
0,088 € 4,40 €
0,078 € 7,80 €
0,067 € 16,75 €
0,059 € 29,50 €
0,051 € 51,00 €
0,046 € 184,00 €
Full Reel (Order in multiples of 10000)
0,046 € 460,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fair-Rite
Product Category: Ferrite Beads
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
0402 (1005 metric)
10 Ohms
500 mA
25 %
50 mOhms
- 55 C
+ 125 C
1 mm
0.5 mm
0.5 mm
Reel
Cut Tape
MouseReel
Brand: Fair-Rite
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Product Type: Ferrite Beads
Factory Pack Quantity: 10000
Subcategory: Ferrites
Test Frequency: 100 MHz
Type: Multilayer Ferrite Chip Bead
Unit Weight: 0,650 mg
Products found:
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Attributes selected: 0

TARIC:
8504509590
CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
KRHTS:
8504502090
MXHTS:
8504509102
BRHTS:
85045000
ECCN:
EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.

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