MFBW1V2012-090-R

Eaton Electronics
704-MFBW1V2012-090-R
MFBW1V2012-090-R

Mfr.:

Description:
Ferrite Beads Multi Nor Cur, Impedance 9 3.0A SMT

Datasheet:
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In Stock: 935

Stock:
935 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,086 € 0,09 €
0,026 € 0,26 €
0,022 € 2,20 €
0,018 € 18,00 €
0,015 € 37,50 €
Full Reel (Order in multiples of 4000)
0,015 € 60,00 €
0,014 € 112,00 €
0,013 € 260,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Eaton
Product Category: Ferrite Beads
RoHS:  
MFBW1V
Multilayer Chip Beads
SMD/SMT
0805 (2012 metric)
9 Ohms
3 A
5 Ohms to 13 Ohms
30 mOhms
- 40 C
+ 85 C
2 mm
1.2 mm
0.9 mm
Reel
Cut Tape
MouseReel
Brand: Eaton Electronics
Product Type: Ferrite Beads
Shielding: Shielded
Factory Pack Quantity: 4000
Subcategory: Ferrites
Test Frequency: 100 MHz
Unit Weight: 10 mg
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Attributes selected: 0

Datasheet

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TARIC:
8504509590
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
ECCN:
EAR99

MFB Multilayer Ferrite Beads

Eaton Electronics MFB Multilayer Ferrite Beads deliver high-impedance performance across a variety of high-frequency applications. These ferrite beads are available in a range of industry-standard sizes and are designed to minimize high-frequency electrical noise in EMI-sensitive applications. The series includes two versions: MFBW, with higher impedance values, and MFBM, ideal for higher current RF/wireless applications. The modules comprise a rugged multilayer construction with proprietary noise suppression. The MFB Multilayer Ferrite Beads use eco-friendly materials and meet RoHS compliance.

5G Applications

Eaton Electronics offers an expansive portfolio of high-reliability components needed to drive 5G forward. Because 5G telecommunication units are typically placed in rugged environments, continuous uptime requirements for their operation and the reliability of the internal electronics are of great importance. A variety of components, often passives, can be readily added in key locations within 5G communications systems to enhance reliability and mitigate subcircuits susceptible to electrostatic discharge (ESD), electromagnetic interference (EMI), and electromagnetic pulse (EMP). Eaton 5G products can withstand harsh environments while delivering high performance.

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