14K-506-418TAA1

EDAC
587-14K-506-418TAA1
14K-506-418TAA1

Mfr.:

Description:
Headers & Wire Housings 14K Series (.098"(2.50mm) contact spacing) Inline side entry surface mount pin header with 6 tin plated contacts in a single row

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 695

Stock:
695 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,636 € 0,64 €
0,538 € 5,38 €
0,504 € 12,60 €
0,484 € 48,40 €
0,435 € 108,75 €
Full Reel (Order in multiples of 700)
0,396 € 277,20 €
0,351 € 491,40 €
0,318 € 1.113,00 €
0,292 € 2.248,40 €

Product Attribute Attribute Value Select Attribute
EDAC
Product Category: Headers & Wire Housings
RoHS:  
Headers
6 Position
2.5 mm (0.098 in)
1 Row
PCB Mount
Solder
Right Angle
Pin (Male)
Tin
14K
Wire-to-Board, Wire-to-Wire
30 AWG to 22 AWG
- 40 C
+ 105 C
Reel
Cut Tape
Brand: EDAC
Contact Material: Brass
Current Rating: 3 A
Flammability Rating: UL 94 V-0
Housing Colour: Natural
Housing Gender: Male
Housing Material: Liquid Crystal Polymer (LCP)
Insulation Resistance: 1 GOhms
Product Type: Headers & Wire Housings
Factory Pack Quantity: 700
Subcategory: Headers & Wire Housings
Voltage Rating: 250 VAC/DC
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TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

14K Inline Connectors

EDAC 14K Inline Connectors include wire-to-wire and wire-to-board connectors that offer a robust connection in a compact design. These connectors support a 2.50mm pitch and accommodate 30AWG to 22AWG wires, offering design flexibility and efficiency. 14K connectors are designed for durability and ruggedized to ensure continuous signal and power integrity and feature contact kinks and optional PCB stabilizers, promoting enhanced mechanical stability and reliable connectivity. Ideal for demanding applications, these connectors offer a suitable solution for dependable wire-to-board and wire-to-wire connections. EDAC 14K Inline Connectors are made for consumer electronics, telecommunications, industrial automation, aerospace, and medical devices.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.