M83513/25-F01CP

Cinch
538-M83513/25-F01CP
M83513/25-F01CP

Mfr.:

Description:
D-Sub Mil Spec Connectors 83513 PCB Sckt 37P Cad F JackPt

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
30 Weeks Estimated factory production time.
Long lead time reported on this product.
Minimum: 50   Multiples: 50
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
144,67 € 7.233,50 €

Product Attribute Attribute Value Select Attribute
Cinch Connectivity Solutions
Product Category: D-Sub Mil Spec Connectors
Connectors
Female
37 Position
2 Row
Solder
Straight
Gold
Board Mount
F
Brand: Cinch
Contact Material: Copper
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: Not Available
Current Rating: 3 A
Insulation: Insulated
Insulation Material: Glass filled, Polyester
Product Type: D-Sub MIL Spec Connectors
Shell Material: Aluminum Alloy
Shell Plating: Cadmium
Factory Pack Quantity: 50
Subcategory: MIL-Spec / MIL-Type
Tradename: Dura-Con
Type: Dura-Con High Reliability Connector
Voltage Rating: 600 VAC
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Attributes selected: 0

USHTS:
8536694040
ECCN:
EAR99

Dura-Con™ Micro-D Connectors

Cinch Dura-Con™ Micro-D Connectors are D-shaped microminiature rectangular connectors that offer a highly adaptable design with an expanded range of termination hardware. These connectors feature a unique twist pin constructed of seven wires around a three-wire core. The twist pin maintains electrical conduction between pins and machined sockets during high shock and vibration to ensure high reliability. The highlight of the Dura-Con system is the pin contact that is made from a precision miniature spring cable with a welded tip. Cinch Dura-Con micro-D connectors are designed for applications that require rugged, durable, and high-performance interconnects. The series is ideal for applications where weight and space must be kept to a minimum while maintaining maximum reliability. Typical applications include miniaturized military and aerospace electronics, data processing equipment, and medical devices.