ADRF5549BCPZN-R7

Analog Devices
584-ADRF5549BCPZN-R7
ADRF5549BCPZN-R7

Mfr.:

Description:
RF Front End 1.8 - 2.8GHz LNA + 40W SPDT, Dual channe

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
10 Weeks Estimated factory production time.
Minimum: 750   Multiples: 750
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
Full Reel (Order in multiples of 750)
20,38 € 15.285,00 €

Product Attribute Attribute Value Select Attribute
Analog Devices Inc.
Product Category: RF Front End
RoHS:  
RF Front End
1.8 GHz to 2.8 GHz
1.4 dB
4.75 V to 5.25 V
85 mA
+ 105 C
SMD/SMT
LFCSP-40
Reel
Brand: Analog Devices
Development Kit: ADRF5549-EVALZ
Gain: 35 dB
Minimum Operating Temperature: - 40 C
Moisture Sensitive: Yes
OIP3 - Third Order Intercept: 32 dBm
P1dB - Compression Point: 19 dBm
Product Type: RF Front End
Factory Pack Quantity: 750
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
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Attributes selected: 0

CAHTS:
8542390000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

RF Solutions

Analog Devices offers components that cover the complete high speed and RF signal chain. The portfolio enables design engineers to develop platform electronic test and measurement systems that have best-in-class performance and low cost of test and ownership across an ever increasing frequency range from DC to > 100GHz and beyond. As the preeminent supplier of data converters, RF and microwave ICs, Analog Devices provides more than 2,000 high performance products across the entire frequency spectrum.
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ADRF5549 Dual-Channel RF FEMs

Analog Devices Inc. ADRF5549 Dual-Channel RF Front-End Modules (FEMs) are designed for Time Division Duplexing (TDD) applications that operate from 1.8GHz to 2.8GHz. These multi-chip modules are configured in dual-channel with a cascading, two-stage, low noise amplifier (LNA), and a high-power silicon single-pole double-throw (SPDT) switch. The ADRF5549 FEMs feature high-power handling capacity, low current supply, high isolation, and low insertion loss. These modules come in RoHS-compliant, compact 6mm x 6mm dimensions and 40-lead frame chip-scale package (LFCSP). Typical applications include wireless infrastructure, TDD-based communication systems, TDD massive multiple input and multiple output (MIMO), and active antenna systems.