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470-3105-600

Name: Amphenol 470-3105-600
Brand: Amphenol TCS
SKU: 523-470-3105-600
Price: 43.07 EUR
Availability: OutOfStock

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Mouser No:

523-470-3105-600

Mfr. No:

470-3105-600

Mfr.:

Amphenol TCS

Description:

Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls

Datasheet:

470-3105-600 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Amphenol TCS 470-3105-600

Availability

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Est. Tariff:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	43,07 €	861,40 €
	41,63 €	2.497,80 €
	39,35 €	3.935,00 €
	39,34 €	10.228,40 €
2.500	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Amphenol
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Receptacles
Number of Positions:	300 Position
Pitch:	1.15 mm (0.045 in)
Number of Rows:	30 Row
Termination Style:	BGA
Mounting Angle:	Vertical
Stack Height:	13 mm, 15 mm, 17 mm, 20 mm
Current Rating:	1 A
Voltage Rating:	600 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 105 C
Contact Plating:	Gold
Contact Material:	Copper Alloy
Housing Material:	Liquid Crystal Polymer (LCP)
Series:	NeXLev
Brand:	Amphenol TCS
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	MX
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	20
Subcategory:	Board to Board & Mezzanine Connectors
Tradename:	NeXLev

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Attributes selected: 0

Filter Document:

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

NeXLev® High-Density Parallel B2B Connectors

Amphenol TCS NeXLev® High-Density Parallel B2B Connectors are capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance. The robust, damage-resistant design includes up to 57 real signals per linear centimeter (145 signals per linear inch), a ball grid array for precise alignment, a compliant BGA-style attachment to increase SMT process yields, and rugged wafer construction. The wafers can be routed to support either single-ended or differential-paired architectures.

NeXLev® Parallel Board-to-Board Connectors

Amphenol TCS NeXLev® product line features High-Density Parallel Board-to-Board Connectors capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance.